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TPU

TPU

TPUv1 以下参考google论文：In-Datacenter Performance Analysis of a Tensor Processing Unit TPU(Tensor Processing Unit)性能指标： 核心是256*256个8-bit MAC 时钟频率700MHz 峰值吞吐率92TeraOps/Second (TOPS)（每个MAC乘和加各算一...

Posted by George Lin on May 12, 2025

QoS

QoS

Quality of Service (QoS) def: a set of technologies that work on a network to guarantee its ability to dependably run high-priority applications and traffic under limited network capacity QoS giv...

Posted by George Lin on May 12, 2025

Flow-Control

Flow-Control

Credit-based flow control https://juejin.cn/post/7042193831445397511 流控 防止网络在拥塞的情况下出现丢帧。 Credit-based flow control本质上是receiver对sender的一种背压（backpressure）机制。其前身源于TCP滑动窗口。 TCP滑动窗口 在上面这张图中，假设...

Posted by George Lin on May 12, 2025

Debug1

沧海万顷，唯系一江潮

“Flipped” and “Decoupled” in Chisel Flipped Purpose: The Flipped method indicates that a particular port is an input to the module instead of an output. This is particularly useful in the cont...

Posted by George Lin on May 12, 2025

DMA

DMA

MCU和SOC的区别 MCU比SoC的外设更简单更少 SoC可以运行操作系统，MCU不能 SoC更重视性能，MCU更重视成本 知乎深入理解AMBA总线 专栏 共20篇深度长文 推荐！！！ https://www.zhihu.com/column/c_1663245806869291008 关于ahb_dmac的programmer model里面的寄存器地址，可以在D...

Posted by George Lin on May 12, 2025

AXI

花气袭人知昼暖

最好的参考专栏 (72 封私信 / 80 条消息) AMBA学习 - 知乎 (72 封私信 / 80 条消息) 深入理解AMBA总线（零）绪论 - 知乎 (72 封私信 / 80 条消息) 深入理解AMBA总线（一）APB总线入门 - 知乎 (72 封私信 / 80 条消息) 深入理解AMBA总线（二）APB slave设计 - 知乎 (72 封私信 / 80 条消息) 深入理解A...

Posted by George Lin on May 12, 2025

ARM-Cortex-M0

ARM-Cortex-M0

感觉对ARM的系统控制没有概念，决定学习arm-modern-soc.pdf TLM （transactional-level modeling） 比RTL更高级的一种抽象。比如 memory Map the allocation of addressable space to hardware resources is called the memory map Boot...

Posted by George Lin on May 12, 2025

APB

闲来无事不从容，睡觉东窗日已红

APB协议总结 概述 APB is designed for accessing the programmable control registers of peripheral devices. 信号 时序 PWAKEUP signaling （only APB5） The wake-up signal, PWAKEUP, is used to ...

Posted by George Lin on May 12, 2025

AHB

不向高枝争月色，愿为深涧渡人行

AMBA AHB-Lite协议总结 参考AMBA 3 AHB-Lite Protocol Specification 基本特征 支持单个master，多个或单个slave 支持burst transfers data bus width configuration: 64, 128, 256,512, 1024 bits Master Interface Sla...

Posted by George Lin on May 12, 2025

3D-IC

3D-IC

Wire Bonding, Flip Chip Bonding, Microbump Wire Bonding: 用金属引线将芯片和PCB连接起来 Flip Chip Bonding（覆晶键合）: 在芯片上连接焊锡凸块（Solder Bump）（Micro-bump），然后将芯片翻转过来使凸块和衬底（substrate）直接连结。 Wire-Bonding-Based 3D I...

Posted by George Lin on May 12, 2025

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